Polybond North America
Polybond North America
Standard Products > Damping Materials


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Name: 7361D

Application: The 7361D damping material is produced as constrained layer or non constrained layer depending on the application. The constrained version is a viscoelastic damping material, a constraining layer, and a protective release paper. The 7361D material is designed to offer the maximum amount of structural damping to panel structures by shearing the highly damped viscoelastic layer between the two constrained layers.

Description: The 7361D material effectively and efficiently reduces the amount of vibration transmitted to a structure resulting in longer fatigue life of the structure or components. Typically, un-damped structures have resonant transmissibilities of 30:1 to 50:1 compared to the input. Damped systems have transmissibilities of 3:1 to 10:1. This significant decrease in transmissibility directly correlates to a reduction in sound power transmission from the structure at resonance.
7361D has an aggressive surface tack and high tensile strength that provides an immediate bond while remaining flexible.

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Name: CLDM - Constrained Layer Damping Material

Application: The CLDM, Constrained Layer Damping Material, has three layers:
a viscoelastic damping material, a polyester constraining layer, and a protective release paper. The CLDM material is designed to offer the maximum amount of structural damping to circuit boards and panel structures by shearing the highly damped viscoelastic layer.

Description: The CLDM, Constrained Layer Damping Material, effectively and efficiently reduces the amount of vibration transmitted to a structure resulting in longer fatigue life of the structure or circuit board components. Typically, undamped structures have resonant transmissablities of 30:1 to 50:1 compared to the input. Systems using Constrained Layer Damping Material have transmissibilities of 3:1 to 10:1. This significant decrease in transmissibility directly correlates to a reduction in sound power transmission from the structure at resonance. Circuit boards can be ruggedized efficiently and cost effectively using CLDM without changes to the components.

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